One-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
Laserx offers comprehensive solutions for die attachment and active alignment, capable of meeting the mass production needs for high-speed optical modules of 400G, 800G, and 1.6T.
By collaborating closely with our customers, Laser X focus on providing off-the-shelf and custom↔ized active alignment solutions to meet the different requirements, ranging from cost sensitive, highly efficient short reach (SR) systems to complex and highly reliable ones for coherent applications. Our in-house high precision m↑achining capability allows us to design customized fixtures§ (like collet, gripper etc.) with quick turnaround time.
Laser X aligners are equipped with high-definition cameras and con¶focal height detectors for initial position and tilt managφement, thereby significantly reducing alignment cycle time and enhancing process yield. The precision mo'tion system can be configured to adapte customer device designs with ♦various optical systems including:
- Plastic lens block (SR),
- Single/dual lenses for EML/DML,
- PIC/FA.
With the rising demand for SiP applications targeting the high-speed, high-density ✔400G/800Gbps market, we have developed active aligners for transce<iver optical systems featuring both single/double lens and FA designs. Successful alignment rΩequires nanoscale precisioning over multiple channels simultaneously, pre₽senting challenges for both hardware and software development. Over the past four years, Laser X aligners have been devel♦oped and supplied to multiple customers for SiP-based transceiver manufacturing,&δnbsp;proving to be a robust and reliable solution for mas₽s production.
Our dual fiber array (FA) aligner is engineered as a standard↕ized platform for SiP device assembly. Gap control between FA and ↓PIC chips has been one of the main challenges for SiP device asse™mbly since the air gap (before applying index matching epoxy) typically need✘s to be<2um. Laser X has achieved this through the develo>pment of a proprietary procedure in our software on standard platform, eliminating the need f♦or expensive sensors. The aligner’s throughput can reach about 7 minutes per unit, significantly he∑lping our customers in saving costs on capital investme≤nt.
Our dual lens aligner is equipped with dual 6-axis precision stages (<50nm). ←Utilizing machine vision and accurate height measurement, Laser X's proprietary software employs s∞ynchronized optimization algorithms for collimating and focusing lenses. This significantly enhances alignment efficiency, achieving throughput rates of approx§imately 10 minutes per unit.
Shenzhen Headquarters:Building 3, Yufengda Industrial Park, Guangmin÷g District, Shenzhen City, Guangdong Province, China
Reception Service Number:0755-23019639
Consultation Email:hongbin.ding@laserx.net & laserx.xs@laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionOne-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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