Solution

Home / Solution / Industrial Laser Burn-in And Tester

Industrial Laser Burn-in And Tester

One-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging

Industrial Laser Burn-in And Tester

Laserx offers high-power burn-in equipment with for Ωhigh precision and extended reliability. These systems are engineered with scal¥ability in mind, making them ideal for both research and development as wφell as mass production.

BT-43431A high power COS burn-in equipment

The BT-43431A supports up to 384 channels, operating in CW and QCW modes.• It includes features for real-time monitoring of optical power, temperaφture, and voltage throughout the burn-in process, providing up-to-d ate status information on the laser chips. Furthermore, the junction temperature during b$urn-in can be verified by reading the laser wavelength individually from reserved optical p¥ort using an external optical spectrum analyzer.

Product Feature

• High capacity, support up to 384 channels

• Support for CW and QCW mode operation

• The faulty product can be powered off individually

• In-sute optical power, temperature and voltage monito¶ring for individual channels

• Optical port reserved for wavelength measurement for chip junction temperature calibration

• Alarm and warning mechanism to ensure the safety operation


CT-40410A high power COS tester

The CT-40410A high-power COS tester delivers cost-effective solution©s to customers. To optimize tester throughput (Units Per Hour), it is  designed with dual test platforms capable of running paral'lel tests, effectively doubling its capacity. Additionally, it employs pre-heating platfor×ms to minimize idle time and enhance efficiency further.

The CT-40410A test solution can be flexibly configured and customized to me©et various needs, supporting both electrical and optical tes¶ts such as LIV, optical spectrum, far-field, and polarization extinction ratio ✔meaurement.

Product Feature

• Automatic Chip/COS ID registration using OCR;

• Flexible load/unload configurations for waffle packs, Gel-packs, and burn-in fixtures;

• Automated binning of post-test chips/COS based on test results;

• Ongoing development to integrate Automated Optical Inspection (AOI) capabilities for defect detecti≤on.

Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guangming District, Shenzhenλ City, Guangdong Province, China

Reception Service Number：0755-23019639

Consultation Email：hongbin.ding@laserx.net & laserx.xs@laserx.net