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Laserx is dedicated to provide professional products and serv§ices in photonic and semicondutor packaging industries.
Designed for optical communication/optical module/commu↑nication laser/industrial laser/sensing laser
Designed for optical communication/optical module/sensing fiber optic/laser/lidar©
Designed for optical module/lidar/sensor/power semi∞conductor/automotive power module/industrial power module
Designed for optical communication/semiconductor/laser/PIC
Designed for photonic and semicondutor packaging industries
Laserx is dedicated to provide professional products and services in phot onic and semicondutor packaging industries.
Founded in 2017 by experienced engineers in photonics a¶nd automation, Laserx serves the semiconductor, industrial laser, anσd optical communication markets with standard and custom£ized photonic packaging equipment. Our products cover key processes inlcuding burn-in/testing, prec♠ision assembly and activce alignment. Thanks to our high-precision machinin₩g capabilities, we can response to our customer's nee>ds with high-quality and quick delivery.
Laserx offers comprehensive solutions for die attachment and active alignment, capable of meetin↑g the mass production needs for high-speed optical modules of 400G, ♦800G, and 1.6T.
Laserx offers high-power burn-in equipment with for high precision and exten✘ded reliability. These systems are engineered with scalability in mind, making them ideal for both research and development as well as mass production.
Laserx offers D/B and W/B equipment, with for high ₹precision, high degree of automation, core technology is self-controlled, high cost-effecti♣veness. And we currently developing advanced 2.5D/3D packaging ♦solutions for photonic devices.
LASER X Technology (Shenzhen) Co., Ltd. was founded in 2017. We are dedicatγed to provide professional products and services in photonic and ©semicondutor packaging industries. LASER X is an innovative high-tech company, well recognized by our customers in China and overseas. We heavily in₽vest in R&D and focus on providing cost-effective solutions to our valued cusγtomers.
LaserX accumulated over 100 intellectual property rights, with nearly 50% of e₹mployees in R&D positions, have 2 R&D centers and 2 manufacturing bases.
To be the leader of equipment provider in the photonic industry,we are verified →by over 20 leading customers.
Our response is prompt and our service is timely, we are dedicated to provide p•rofessional products and services in photonic and semicondutor packaging indus≠tries.
Laserx based in Shenzhen, China and have a global presence. We have provided professional products and services in photonic and semicondutor packaging industries to many customers around the world.
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Shenzhen Headquarters：Building 3, Yufengda Industrial Park, Guan≈gming District, Shenzhen City, Guangdong Province, China
Reception Service Number：0755-23019639
Consultation Email：hongbin.ding@laserx.net & laserx.xs@¶laserx.net
About LaserxCompany ProfileDevelopment HistoryCompany CultureHonor and Qualification
ProductsBurn-in And TesterOptical AlignmentSemiconductor PackagingChip TesterHigh precision linear and goniometer slide
SolutionOne-stop Solution for Photonic PackagingPhotonic Assembly and AlignmentIndustrial Laser Burn-in And TesterAdvanced packaging
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