Heavy Wire Bonder-LASER X Technology (Shenzhen) Co., Ltd.

Semiconductor Packaging

Burn-in And Tester Optical Alignment Semiconductor Packaging Chip Tester High precision linear and goniometer slide

Semiconductor Packaging

Heavy Wire Bonder

Product Feature

• Dual bonding head for higher production efficiency
• Stable bonding force control improve bonding quality and reliability
• Programmable ultrasonic power at different stages
• Real-time bond line length detection
• Tension detection to ensure product quality
• Quickly change of ribbon wire, aluminum wire

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Product Parameter

3Heavy Wire Bonder-2.jpg

Shenzhen Headquarters：Building 3, Yufengda Industrial Par€k, Guangming District, Shenzhen City, Guangdong Province, China

Reception Service Number：0755-23019639

Consultation Email：hongbin.ding@laserx.net & laserx.xs@laser✘x.net

About LaserxCompany Profile Development History Company Culture Honor and Qualification

ProductsBurn-in And Tester Optical Alignment Semiconductor Packaging Chip Tester High precision linear and goniometer slide

SolutionOne-stop Solution for Photonic Packaging Photonic Assembly and Alignment Industrial Laser Burn-in And Tester Advanced packaging

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MrDing: 18923755822
hongbin.ding@laserx.net
laserx.xs@laserx.net